MediumChemistry
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In electroplating of copper, K[Ag(CN)2] is used instead of AgNO3. The reason is –
A
A thin layer of Ag is formed on Cu
B
More voltage is required
C
Ag+ ions are completely removed from solution
D
less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]− ion
Explanation
Complex formation lowers free Ag⁺ concentration and ensures smooth deposition.
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